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Vol. 36 No. 1 (2023): Journal of Surface Mount Technology
					View Vol. 36 No. 1 (2023): Journal of Surface Mount Technology

This issue includes three papers of significance to the electronics manufacturing industry. The first paper investigates the influence of Pb-poisoning on Sn-whisker formation (and mitigation) on tin plated components, and provided a guidance to revise GEIA-STD-0005-2. The next paper closely studied the reliability of various BGA packages under static flexural loading at different temperatures up to 125°C along with Finite Element Modeling (FEM) to provide risk assessment for designers. The final paper delved into a novel approach for printing conformal interconnects with Aerosol Jet® direct-write technology that can offer package designers an alternate approach to wire bonding and other widely used interconnection techniques.

Published: 2023-03-20

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Welcome to the Journal of Surface Mount Technology

The Journal of SMT is a quarterly, peer-reviewed, technical publication of articles related to electronic manufacturing technologies, including microsystems, emerging technologies, and related business operations.


Committee Mission Statement

The mission of the SMTA Journal Committee is to select and review papers for publication in the Journal of SMT, ensuring a high standard of quality for each issue and ensuring article content best serves SMTA membership and the electronics industry as a whole.


Committee Members

Srinivas Chada, Ph.D., Amazon, Committee Chair

Kola Akinade, Ph.D., Quest International

Babak Arfaei, Ph.D., Ford Motor Company

Raiyo Aspandiar, Ph.D., Intel Corporation

Nilesh Badwe, Ph.D., IIT Kanpur

Tom Borkes, The Jefferson Project

Rich Brooks, Spartronics

Jean-Paul Clech, Ph.D., EPSI, Inc.

Richard Coyle, Ph.D., Nokia Bell Labs

Gary Freedman, Colab Engineering, LLC

Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory

David Hillman, Collins Aerospace (Retired)

Amol Kane, Schlumberger

Pradeep Lall, Ph.D., M.B.A., Auburn University

Tae-Kyu Lee, Ph.D., Cisco Systems, Inc.

Luu Nguyen, Ph.D., Psi Quantum

Anthony Primavera, Ph.D., Micro Systems Engineering, Inc.

Viswanadham Puligandla, Ph.D., Nokia (Retired)

Brian Roggeman, Qualcomm Technologies Inc.

Bhanu Sood, Ph.D., NASA Goddard Space Flight Center

Paul Vianco, Ph.D., Sandia National Laboratories (Retired)