The days of autonomous cars and incorporating radar and lidar in the automotive sector are upon us. So, the first paper presents the reliability study of WLCSP for such applications. With the continued use of finer pitch components, it is imperative that we evaluate the SIR properties of fluxes to be used with the reduced lead spacing. The second paper presents a gage study to compare the SIR of various fluxes used in conjunction with fine pitch test patterns. The last paper investigates the effect of Ni contamination on the solderability within PTHs.
Welcome to the Journal of Surface Mount Technology
The Journal of SMT is a quarterly, peer-reviewed, technical publication of articles related to electronic manufacturing technologies, including microsystems, emerging technologies, and related business operations.
Committee Mission Statement
The mission of the SMTA Journal Committee is to select and review papers for publication in the Journal of SMT, ensuring a high standard of quality for each issue and ensuring article content best serves SMTA membership and the electronics industry as a whole.
Srinivas Chada, Ph.D., Amazon, Committee Chair
Kola Akinade, Ph.D., Quest International
Babak Arfaei, Ph.D., Ford Motor Company
Raiyo Aspandiar, Ph.D., Intel Corporation
Nilesh Badwe, Ph.D., IIT Kanpur
Tom Borkes, The Jefferson Project
Rich Brooks, Spartronics
Jean-Paul Clech, Ph.D., EPSI, Inc.
Richard Coyle, Ph.D., Nokia Bell Labs
Gary Freedman, Colab Engineering, LLC
Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory
David Hillman, Collins Aerospace (Retired)
Amol Kane, Schlumberger
Pradeep Lall, Ph.D., M.B.A., Auburn University
Tae-Kyu Lee, Ph.D., Cisco Systems, Inc.
Luu Nguyen, Ph.D., Psi Quantum
Anthony Primavera, Ph.D., Micro Systems Engineering, Inc.
Viswanadham Puligandla, Ph.D., Nokia (Retired)
Brian Roggeman, Qualcomm Technologies Inc.
Bhanu Sood, Ph.D., NASA Goddard Space Flight Center
Paul Vianco, Ph.D., Sandia National Laboratories (Retired)