Current Issue
Vol. 36 No. 1 (2023): Journal of Surface Mount Technology
This issue includes three papers of significance to the electronics manufacturing industry. The first paper investigates the influence of Pb-poisoning on Sn-whisker formation (and mitigation) on tin plated components, and provided a guidance to revise GEIA-STD-0005-2. The next paper closely studied the reliability of various BGA packages under static flexural loading at different temperatures up to 125°C along with Finite Element Modeling (FEM) to provide risk assessment for designers. The final paper delved into a novel approach for printing conformal interconnects with Aerosol Jet® direct-write technology that can offer package designers an alternate approach to wire bonding and other widely used interconnection techniques.
Published:
2023-03-20
Full Issue
Welcome to the Journal of Surface Mount Technology
The Journal of SMT is a quarterly, peer-reviewed, technical publication of articles related to electronic manufacturing technologies, including microsystems, emerging technologies, and related business operations.
Committee Mission Statement
The mission of the SMTA Journal Committee is to select and review papers for publication in the Journal of SMT, ensuring a high standard of quality for each issue and ensuring article content best serves SMTA membership and the electronics industry as a whole.
Committee Members
Srinivas Chada, Ph.D., Amazon, Committee Chair
Kola Akinade, Ph.D., Quest International
Babak Arfaei, Ph.D., Ford Motor Company
Raiyo Aspandiar, Ph.D., Intel Corporation
Nilesh Badwe, Ph.D., IIT Kanpur
Tom Borkes, The Jefferson Project
Rich Brooks, Spartronics
Jean-Paul Clech, Ph.D., EPSI, Inc.
Richard Coyle, Ph.D., Nokia Bell Labs
Gary Freedman, Colab Engineering, LLC
Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory
David Hillman, Collins Aerospace (Retired)
Amol Kane, Schlumberger
Pradeep Lall, Ph.D., M.B.A., Auburn University
Tae-Kyu Lee, Ph.D., Cisco Systems, Inc.
Luu Nguyen, Ph.D., Psi Quantum
Anthony Primavera, Ph.D., Micro Systems Engineering, Inc.
Viswanadham Puligandla, Ph.D., Nokia (Retired)
Brian Roggeman, Qualcomm Technologies Inc.
Bhanu Sood, Ph.D., NASA Goddard Space Flight Center
Paul Vianco, Ph.D., Sandia National Laboratories (Retired)
