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Vol. 33 No. 2 (2020): Journal of Surface Mount Technology
Journal of Surface Mount Technology, Volume 33, Issue 2

This issue includes three papers of significance to the electronics manufacturing industry. In the first paper, how conformal coating stresses the WLCSP is studied under conditions of thermal cycling. Next, we focus on enhancing the productivity of plating on PCBs using periodic pulse plating technique. The final paper discusses the effects of multi-axial loading on performance of WLCSP during thermal cycling.

Published: 2020-10-02


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Welcome to the Journal of Surface Mount Technology

The Journal of SMT is a quarterly, peer-reviewed, technical publication of articles related to electronic manufacturing technologies, including microsystems, emerging technologies, and related business operations.


Committee Mission Statement

The mission of the SMTA Journal Committee is to select and review papers for publication in the Journal of SMT, ensuring a high standard of quality for each issue and ensuring article content best serves SMTA membership and the electronics industry as a whole.


Committee Members

Srinivas Chada, Ph.D., Stryker, Committee Chair

Kola Akinade, Ph.D., Cisco Systems, Inc.

Raiyo Aspandiar, Ph.D., Intel Corporation

Nilesh Badwe, Ph.D., Intel Corporation

Tom Borkes, The Jefferson Project

Rich Brooks, Luminar Technologies 

Jean-Paul Clech, Ph.D., EPSI, Inc.

Richard Coyle, Ph.D., Nokia Bell Labs

Gary Freedman, Colab Engineering, LLC

Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory

David Hillman, Collins Aerospace

Amol Kane, Schlumberger

Pradeep Lall, Ph.D., M.B.A., Auburn University

Tae-Kyu Lee, Ph.D., Portland State University

Luu Nguyen, Ph.D., Psi Quantum

Anthony Primavera, Ph.D., Micro Systems Engineering, Inc.

Viswanadham Puligandla, Ph.D., Nokia (Retired)

Brian Roggeman, Qualcomm Technologies Inc.

Bhanu Sood, Ph.D., NASA Goddard Space Flight Center

Paul Vianco, Ph.D., Sandia National Laboratories