Current Issue

Vol. 34 No. 1 (2021): Journal of Surface Mount Technology

This issue includes three papers of significance to the electronics manufacturing industry. The first paper is the third and final part of a study we have published over the past year on Tin Whisker Formation and this part goes in-depth on characterization and mechanisms. The second paper describes a novel process for direct writing polymer-thick-film resistors for printed electronics. The third paper addresses the reliability and performance of wafer level fan out packages for automotive radar applications.

Published: 2021-04-06

Full Issue

Articles

Tin Whisker Formation on Small Outline Transistors Assembled Using Bismuth-Containing Lead-Free Solder Alloys After Long-Term Ambient Temperature, High Humidity Storage Part 3: In-Depth Characterization and Mechanisms

André M. Delhaise, Stephan Meschter, Polina Snugovsky, Jeff Kennedy, Zohreh Bagheri

11-23
- PDF
Aerosol Jet Direct Writing Polymer-Thick-Film Resistors for Printed Electronics

James Feng, Anthony Loveland, Michael Renn

24-31
- PDF
Reliability and Performance of Wafer Level Fan Out Package for Automotive Radar

Walter Hartner, Martin Niessner, Francesca Arcioni, Markus Fink, Christian Geissler, Birgit Hebler, Gerhard Haubner, Maciej Wojnowski

32-39
- PDF

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Welcome to the Journal of Surface Mount Technology

The Journal of SMT is a quarterly, peer-reviewed, technical publication of articles related to electronic manufacturing technologies, including microsystems, emerging technologies, and related business operations.

Committee Mission Statement

The mission of the SMTA Journal Committee is to select and review papers for publication in the Journal of SMT, ensuring a high standard of quality for each issue and ensuring article content best serves SMTA membership and the electronics industry as a whole.

Committee Members

Srinivas Chada, Ph.D., Raytheon Missile Systems, Committee Chair

Kola Akinade, Ph.D., Cisco Systems, Inc.

Raiyo Aspandiar, Ph.D., Intel Corporation

Nilesh Badwe, Ph.D., IIT Kanpur

Tom Borkes, The Jefferson Project

Rich Brooks, Luminar Technologies

Jean-Paul Clech, Ph.D., EPSI, Inc.

Richard Coyle, Ph.D., Nokia Bell Labs

Gary Freedman, Colab Engineering, LLC

Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory

David Hillman, Collins Aerospace

Amol Kane, Schlumberger

Pradeep Lall, Ph.D., M.B.A., Auburn University

Tae-Kyu Lee, Ph.D., Portland State University

Luu Nguyen, Ph.D., Psi Quantum

Anthony Primavera, Ph.D., Micro Systems Engineering, Inc.

Viswanadham Puligandla, Ph.D., Nokia (Retired)

Brian Roggeman, Qualcomm Technologies Inc.

Bhanu Sood, Ph.D., NASA Goddard Space Flight Center

Paul Vianco, Ph.D., Sandia National Laboratories