Current Issue
Vol. 33 No. 2 (2020): Journal of Surface Mount Technology
This issue includes three papers of significance to the electronics manufacturing industry. In the first paper, how conformal coating stresses the WLCSP is studied under conditions of thermal cycling. Next, we focus on enhancing the productivity of plating on PCBs using periodic pulse plating technique. The final paper discusses the effects of multi-axial loading on performance of WLCSP during thermal cycling.
Published:
2020-10-02
Articles
Welcome to the Journal of Surface Mount Technology
The Journal of SMT is a quarterly, peer-reviewed, technical publication of articles related to electronic manufacturing technologies, including microsystems, emerging technologies, and related business operations.
Committee Mission Statement
The mission of the SMTA Journal Committee is to select and review papers for publication in the Journal of SMT, ensuring a high standard of quality for each issue and ensuring article content best serves SMTA membership and the electronics industry as a whole.
Committee Members
Srinivas Chada, Ph.D., Stryker, Committee Chair
Kola Akinade, Ph.D., Cisco Systems, Inc.
Raiyo Aspandiar, Ph.D., Intel Corporation
Nilesh Badwe, Ph.D., Intel Corporation
Tom Borkes, The Jefferson Project
Rich Brooks, Luminar Technologies
Jean-Paul Clech, Ph.D., EPSI, Inc.
Richard Coyle, Ph.D., Nokia Bell Labs
Gary Freedman, Colab Engineering, LLC
Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory
David Hillman, Collins Aerospace
Amol Kane, Schlumberger
Pradeep Lall, Ph.D., M.B.A., Auburn University
Tae-Kyu Lee, Ph.D., Portland State University
Luu Nguyen, Ph.D., Psi Quantum
Anthony Primavera, Ph.D., Micro Systems Engineering, Inc.
Viswanadham Puligandla, Ph.D., Nokia (Retired)
Brian Roggeman, Qualcomm Technologies Inc.
Bhanu Sood, Ph.D., NASA Goddard Space Flight Center
Paul Vianco, Ph.D., Sandia National Laboratories
