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Vol. 33 No. 1 (2020): Journal of Surface Mount Technology
Journal of SMT vol 33 issue 1 cover

This issue includes three papers of importance to the electronics manufacturing industry. The first paper studies tin whisker growth on low temperature Bismuth containing lead-free solders under various conditions. The penultimate paper researches defect mitigation through solder joint encapsulation. The last paper explores a novel method to model 'hot tears' that are common in solder joints due to differential cooling during formation.

Published: 2020-07-14
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Welcome to the Journal of Surface Mount Technology

The Journal of SMT is a quarterly, peer-reviewed, technical publication of articles related to electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

 

Committee Mission Statement

The mission of the SMTA Journal Committee is to select and review papers for publication in the Journal of SMT, ensuring a high standard of quality for each issue and ensuring article content best serves SMTA membership.

 

Committee Members

Srinivas Chada, Ph.D., Stryker, Committee Chair

Kola Akinade, Ph.D., Cisco Systems, Inc.

Raiyo Aspandiar, Ph.D., Intel Corporation

Nilesh Badwe, Ph.D., Intel Corporation

Tom Borkes, The Jefferson Project

Rich Brooks, Jabil Circuit, Inc.

Jean-Paul Clech, Ph.D., EPSI, Inc.

Richard Coyle, Ph.D., Nokia Bell Labs

Gary Freedman, Colab Engineering, LLC

Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory

David Hillman, Collins Aerospace

Amol Kane, Schlumberger

Pradeep Lall, Ph.D., M.B.A., Auburn University

Tae-Kyu Lee, Ph.D., Portland State University

Luu Nguyen, Ph.D., Psi Quantum

Anthony Primavera, Ph.D., Micro Systems Engineering, Inc.

Viswanadham Puligandla, Ph.D., Nokia (Retired)

Brian Roggeman, Qualcomm Technologies Inc.

Bhanu Sood, Ph.D., NASA Goddard Space Flight Center

Paul Vianco, Ph.D., Sandia National Laboratories