Periodic Pulse Plating of Mid-Aspect Ratio Printed Circuit Boards for Enhanced Productivity

Abstract

ABSTRACT

Pulse plating of copper has typically found use in the plating of very difficult, high aspect ratio printed circuit boards. Its ability to provide throwing power deep within through holes with aspect ratios as high as 30:1 is well established. This technology has long been thought of as a high technology, high cost, specialty process applicable only to high end products. This paper will discuss the advantages that pulse plating offers over conventional DC copper plating in high volume production applications for panels with aspect ratios of up to 12:1. These advantages are reduced plating time, increased throughput, and reduced plated copper thickness on the panel surface while meeting minimum in-hole copper thickness requirements.