Impact of Conformal Coating Induced Stress on Wafer Level Chip Scale Package Thermal Cycling Performance. Journal of Surface Mount Technology, [S. l.], v. 33, n. 2, p. 7–13, 2020. DOI: 10.37665/smt.v33i2.8. Disponível em: http://journal.smta.org/index.php/smt/article/view/8. Acesso em: 29 sep. 2025.