High Density RDL Technologies for Panel Level Packaging of Embedded Dies. Journal of Surface Mount Technology, [S. l.], v. 34, n. 2, p. 23–29, 2021. DOI: 10.37665/smt.v34i2.11. Disponível em: http://journal.smta.org/index.php/smt/article/view/11. Acesso em: 26 oct. 2025.