HILLMAN, D.; PEARSON, T.; WILCOXON, R.; JACOBSON, P.; JEAN, D. An Investigation on the Influence of Nickel Contamination of Plated Through Hole (PTH) Solder Joint Integrity. Journal of Surface Mount Technology, [S. l.], v. 35, n. 1, p. 24–37, 2022. DOI: 10.37665/smt.v35i1.27. Disponível em: http://journal.smta.org/index.php/smt/article/view/27. Acesso em: 28 may. 2023.