Comparison of Electromigration in Tin-Bismuth Planar and Bottom Terminated Component Solder Joints. Journal of Surface Mount Technology, [S. l.], v. 37, n. 3, p. 16–23, 2024. DOI: 10.37665/aha4dx58. Disponível em: http://journal.smta.org/index.php/smt/article/view/59. Acesso em: 17 feb. 2025.