Delhaise, A., Meschter, S., Snugovsky, P., Kennedy, J. and Bagheri, Z. (2020) “Tin Whisker Formation on Small Outline Transistors Assembled Using Bismuth-Containing Lead-Free Solder Alloys After Long-Term Ambient Temperature, High Humidity Storage Part 2: Statistical Analysis”, Journal of Surface Mount Technology, 33(1), pp. 7-19. doi: 10.37665/smt.v33i1.14.