1.
Delhaise A, Meschter S, Snugovsky P, Kennedy J, Bagheri Z. Tin Whisker Formation on Small Outline Transistors Assembled Using Bismuth-Containing Lead-Free Solder Alloys After Long-Term Ambient Temperature, High Humidity Storage Part 2: Statistical Analysis. Journal of SMT [Internet]. 2020Jul.14 [cited 2020Aug.6];33(1):7-19. Available from: http://journal.smta.org/index.php/smt/article/view/14