1.
Teng S, Guirguis C, Ramakrishna G, Ly H. Investigation of Solder Joint Encapsulant Materials for Defect Mitigation. Journal of SMT [Internet]. 2020Jul.14 [cited 2020Aug.6];33(1):20-7. Available from: http://journal.smta.org/index.php/smt/article/view/3