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Vol. 34 No. 2 (2021): Journal of Surface Mount Technology
					View Vol. 34 No. 2 (2021): Journal of Surface Mount Technology

This issue includes three papers of significance to the electronics manufacturing industry. The first paper covers Dissimilar Self-Alignment Characteristics of Smaller Passive Components. The second paper addresses Miniaturized Stacked Die QFN for Tire Pressure Monitoring System Applications. The third paper discusses High Density RDL Technologies for Panel Level Packaging of Embedded Dies. 

Published: 2021-07-28

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Welcome to the Journal of Surface Mount Technology

The Journal of SMT is a quarterly, peer-reviewed, technical publication of articles related to electronic manufacturing technologies, including microsystems, emerging technologies, and related business operations.


Committee Mission Statement

The mission of the SMTA Journal Committee is to select and review papers for publication in the Journal of SMT, ensuring a high standard of quality for each issue and ensuring article content best serves SMTA membership and the electronics industry as a whole.


Committee Members

Srinivas Chada, Ph.D., Raytheon Missile Systems, Committee Chair

Kola Akinade, Ph.D., Quest International

Babak Arfaei, Ph.D., Ford Motor Company

Raiyo Aspandiar, Ph.D., Intel Corporation

Nilesh Badwe, Ph.D., IIT Kanpur

Tom Borkes, The Jefferson Project

Rich Brooks, Spartronics

Jean-Paul Clech, Ph.D., EPSI, Inc.

Richard Coyle, Ph.D., Nokia Bell Labs

Gary Freedman, Colab Engineering, LLC

Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory

David Hillman, Collins Aerospace

Amol Kane, Schlumberger

Pradeep Lall, Ph.D., M.B.A., Auburn University

Tae-Kyu Lee, Ph.D., Cisco Systems, Inc.

Luu Nguyen, Ph.D., Psi Quantum

Anthony Primavera, Ph.D., Micro Systems Engineering, Inc.

Viswanadham Puligandla, Ph.D., Nokia (Retired)

Brian Roggeman, Qualcomm Technologies Inc.

Bhanu Sood, Ph.D., NASA Goddard Space Flight Center

Paul Vianco, Ph.D., Sandia National Laboratories