This issue includes three papers of importance to the electronics manufacturing industry. The first paper studies tin whisker growth on low temperature Bismuth containing lead-free solders under various conditions. The penultimate paper researches defect mitigation through solder joint encapsulation. The last paper explores a novel method to model 'hot tears' that are common in solder joints due to differential cooling during formation.
Welcome to the Journal of Surface Mount Technology
The Journal of SMT is a quarterly, peer-reviewed, technical publication of articles related to electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
Committee Mission Statement
The mission of the SMTA Journal Committee is to select and review papers for publication in the Journal of SMT, ensuring a high standard of quality for each issue and ensuring article content best serves SMTA membership.
Srinivas Chada, Ph.D., Stryker, Committee Chair
Kola Akinade, Ph.D., Cisco Systems, Inc.
Raiyo Aspandiar, Ph.D., Intel Corporation
Nilesh Badwe, Ph.D., Intel Corporation
Tom Borkes, The Jefferson Project
Rich Brooks, Jabil Circuit, Inc.
Jean-Paul Clech, Ph.D., EPSI, Inc.
Richard Coyle, Ph.D., Nokia Bell Labs
Gary Freedman, Colab Engineering, LLC
Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory
David Hillman, Collins Aerospace
Amol Kane, Schlumberger
Pradeep Lall, Ph.D., M.B.A., Auburn University
Tae-Kyu Lee, Ph.D., Portland State University
Luu Nguyen, Ph.D., Psi Quantum
Anthony Primavera, Ph.D., Micro Systems Engineering, Inc.
Viswanadham Puligandla, Ph.D., Nokia (Retired)
Brian Roggeman, Qualcomm Technologies Inc.
Bhanu Sood, Ph.D., NASA Goddard Space Flight Center
Paul Vianco, Ph.D., Sandia National Laboratories