Archives
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Journal of Surface Mount Technology
Vol. 37 No. 3 (2024)In this issue, we bring you three interesting technical articles. The first paper explores the intermediate barrier performance of electroless Co-W-B and Ni-P stacked deposits. We follow that with a look at a cleaning process simulation using glass test boards. The final paper compares electromigration in tin-bismuth planar and bottom terminated component solder joints.
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Journal of Surface Mount Technology
Vol. 37 No. 2 (2024)We bring you three interesting technical articles in this edition. The first paper explores a novel method to improve properties of flexible hybrid electronics that are additively manufactured and incorporating carbon nano tubes. We follow that with an application-oriented paper, wherein two different flexible hybrid electronics are compared for monitoring temperature withing storage containers. The final paper summarizes the effect of intermetallic compounds (IMC) on solder joint reliability from various solder compositions.
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Journal of Surface Mount Technology
Vol. 37 No. 1 (2024)The first article in this issue is a compilation paper that lays out the various criteria used in solder alloy adoption. The second paper tests conformal coating in various testing environments. The last paper investigates solder joint reliability in conjunction with matte-Sn electroplating.
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Journal of Surface Mount Technology
Vol. 36 No. 3 (2023)As we enter the fall season, we are eager to share another issue of high quality electronics manufacturing research for you to read. This issue features research on three rather distinct topics. The first article addresses a novel process evaluation technique for enhancing yields for advanced low-profile bottom terminated component packages. The second article examines solderability of additively manufactured copper surfaces. The third paper demonstrates properties of mixing SAC solder alloys with Bismuth-containing alloys for a low reflow temperature process.
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Journal of Surface Mount Technology
Vol. 36 No. 2 (2023)As we kick off the summer season, we are eager to share another issue of high quality electronics manufacturing research for you to read. The first article addresses Modeling the Effects of Thermal Pad Voiding on Quad Flatpack No-lead (QFN) Components. The second article provides a review of how the research has evolved related to Pb-Free Solders and Aerospace/Defense (A&D) High Performance Considerations over the decades. The third paper demonstrates a novel solder connect technology for Lower Temperature Soldering Using Supercooled Liquid Metal.
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Journal of Surface Mount Technology
Vol. 36 No. 1 (2023)This issue includes three papers of significance to the electronics manufacturing industry. The first paper investigates the influence of Pb-poisoning on Sn-whisker formation (and mitigation) on tin plated components, and provided a guidance to revise GEIA-STD-0005-2. The next paper closely studied the reliability of various BGA packages under static flexural loading at different temperatures up to 125°C along with Finite Element Modeling (FEM) to provide risk assessment for designers. The final paper delved into a novel approach for printing conformal interconnects with Aerosol Jet® direct-write technology that can offer package designers an alternate approach to wire bonding and other widely used interconnection techniques.
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Journal of Surface Mount Technology
Vol. 35 No. 1 (2022)The days of autonomous cars and incorporating radar and lidar in the automotive sector are upon us. So, the first paper presents the reliability study of WLCSP for such applications. With the continued use of finer pitch components, it is imperative that we evaluate the SIR properties of fluxes to be used with the reduced lead spacing. The second paper presents a gage study to compare the SIR of various fluxes used in conjunction with fine pitch test patterns. The last paper investigates the effect of Ni contamination on the solderability within PTHs.
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Journal of Surface Mount Technology
Vol. 34 No. 2 (2021)This issue includes three papers of significance to the electronics manufacturing industry. The first paper covers Dissimilar Self-Alignment Characteristics of Smaller Passive Components. The second paper addresses Miniaturized Stacked Die QFN for Tire Pressure Monitoring System Applications. The third paper discusses High Density RDL Technologies for Panel Level Packaging of Embedded Dies.
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Journal of Surface Mount Technology
Vol. 34 No. 1 (2021)This issue includes three papers of significance to the electronics manufacturing industry. The first paper is the third and final part of a study we have published over the past year on Tin Whisker Formation and this part goes in-depth on characterization and mechanisms. The second paper describes a novel process for direct writing polymer-thick-film resistors for printed electronics. The third paper addresses the reliability and performance of wafer level fan out packages for automotive radar applications.
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Journal of Surface Mount Technology
Vol. 33 No. 2 (2020)This issue includes three papers of significance to the electronics manufacturing industry. In the first paper, how conformal coating stresses the WLCSP is studied under conditions of thermal cycling. Next, we focus on enhancing the productivity of plating on PCBs using periodic pulse plating technique. The final paper discusses the effects of multi-axial loading on performance of WLCSP during thermal cycling.
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Journal of Surface Mount Technology
Vol. 33 No. 1 (2020)This issue includes three papers of importance to the electronics manufacturing industry. The first paper studies tin whisker growth on low temperature Bismuth containing lead-free solders under various conditions. The penultimate paper researches defect mitigation through solder joint encapsulation. The last paper explores a novel method to model 'hot tears' that are common in solder joints due to differential cooling during formation.
