Archives

  • Journal of SMT vol 33 issue 1 cover Journal of Surface Mount Technology
    Vol. 33 No. 1 (2020)

    This issue includes three papers of importance to the electronics manufacturing industry. The first paper studies tin whisker growth on low temperature Bismuth containing lead-free solders under various conditions. The penultimate paper researches defect mitigation through solder joint encapsulation. The last paper explores a novel method to model 'hot tears' that are common in solder joints due to differential cooling during formation.