Archives

  • Journal of SMT vol 33 issue 1 cover Journal of Surface Mount Technology
    Vol. 33 No. 1 (2020)

    This issue includes three papers of importance to the electronics manufacturing industry. The first paper studies tin whisker growth on low temperature Bismuth containing lead-free solders under various conditions. The penultimate paper researches defect mitigation through solder joint encapsulation. The last paper explores a novel method to model 'hot tears' that are common in solder joints due to differential cooling during formation.

  • Journal of Surface Mount Technology
    Vol. 34 No. 2 (2021)

    This issue includes three papers of significance to the electronics manufacturing industry. The first paper covers Dissimilar Self-Alignment Characteristics of Smaller Passive Components. The second paper addresses Miniaturized Stacked Die QFN for Tire Pressure Monitoring System Applications. The third paper discusses High Density RDL Technologies for Panel Level Packaging of Embedded Dies. 

  • Journal of Surface Mount Technology, Volume 33, Issue 2 Journal of Surface Mount Technology
    Vol. 33 No. 2 (2020)

    This issue includes three papers of significance to the electronics manufacturing industry. In the first paper, how conformal coating stresses the WLCSP is studied under conditions of thermal cycling. Next, we focus on enhancing the productivity of plating on PCBs using periodic pulse plating technique. The final paper discusses the effects of multi-axial loading on performance of WLCSP during thermal cycling.

  • Journal of Surface Mount Technology
    Vol. 34 No. 1 (2021)

    This issue includes three papers of significance to the electronics manufacturing industry. The first paper is the third and final part of a study we have published over the past year on Tin Whisker Formation and this part goes in-depth on characterization and mechanisms. The second paper describes a novel process for direct writing polymer-thick-film resistors for printed electronics. The third paper addresses the reliability and performance of wafer level fan out packages for automotive radar applications.