Archives

  • Journal of SMT vol 33 issue 1 cover

    Journal of Surface Mount Technology
    Vol. 33 No. 1 (2020)

    This issue includes three papers of importance to the electronics manufacturing industry. The first paper studies tin whisker growth on low temperature Bismuth containing lead-free solders under various conditions. The penultimate paper researches defect mitigation through solder joint encapsulation. The last paper explores a novel method to model 'hot tears' that are common in solder joints due to differential cooling during formation.

  • Journal of Surface Mount Technology
    Vol. 34 No. 1 (2021)

    This issue includes three papers of significance to the electronics manufacturing industry. The first paper is the third and final part of a study we have published over the past year on Tin Whisker Formation and this part goes in-depth on characterization and mechanisms. The second paper describes a novel process for direct writing polymer-thick-film resistors for printed electronics. The third paper addresses the reliability and performance of wafer level fan out packages for automotive radar applications. 

  • Journal of Surface Mount Technology
    Vol. 35 No. 1 (2022)

    The days of autonomous cars and incorporating radar and lidar in the automotive sector are upon us. So, the first paper presents the reliability study of WLCSP for such applications. With the continued use of finer pitch components, it is imperative that we evaluate the SIR properties of fluxes to be used with the reduced lead spacing. The second paper presents a gage study to compare the SIR of various fluxes used in conjunction with fine pitch test patterns. The last paper investigates the effect of Ni contamination on the solderability within PTHs.

  • Journal of Surface Mount Technology, Volume 33, Issue 2

    Journal of Surface Mount Technology
    Vol. 33 No. 2 (2020)

    This issue includes three papers of significance to the electronics manufacturing industry. In the first paper, how conformal coating stresses the WLCSP is studied under conditions of thermal cycling. Next, we focus on enhancing the productivity of plating on PCBs using periodic pulse plating technique. The final paper discusses the effects of multi-axial loading on performance of WLCSP during thermal cycling.

  • Journal of Surface Mount Technology
    Vol. 34 No. 2 (2021)

    This issue includes three papers of significance to the electronics manufacturing industry. The first paper covers Dissimilar Self-Alignment Characteristics of Smaller Passive Components. The second paper addresses Miniaturized Stacked Die QFN for Tire Pressure Monitoring System Applications. The third paper discusses High Density RDL Technologies for Panel Level Packaging of Embedded Dies. 

  • Journal of Surface Mount Technology
    Vol. 36 No. 1 (2023)

    This issue includes three papers of significance to the electronics manufacturing industry. The first paper investigates the influence of Pb-poisoning on Sn-whisker formation (and mitigation) on tin plated components, and provided a guidance to revise GEIA-STD-0005-2. The next paper closely studied the reliability of various BGA packages under static flexural loading at different temperatures up to 125°C along with Finite Element Modeling (FEM) to provide risk assessment for designers. The final paper delved into a novel approach for printing conformal interconnects with Aerosol Jet® direct-write technology that can offer package designers an alternate approach to wire bonding and other widely used interconnection techniques.