Vol. 33 No. 1 (2020): Journal of Surface Mount Technology

Journal of SMT vol 33 issue 1 cover

This issue includes three papers of importance to the electronics manufacturing industry. The first paper studies tin whisker growth on low temperature Bismuth containing lead-free solders under various conditions. The penultimate paper researches defect mitigation through solder joint encapsulation. The last paper explores a novel method to model 'hot tears' that are common in solder joints due to differential cooling during formation.

Published: 2020-07-14

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