Vol. 37 No. 3 (2024): Journal of Surface Mount Technology

Journal of SMT Volume 37 Issue 3

In this issue, we bring you three interesting technical articles. The first paper explores the intermediate barrier performance of electroless Co-W-B and Ni-P stacked deposits. We follow that with a look at a cleaning process simulation using glass test boards. The final paper compares electromigration in tin-bismuth planar and bottom terminated component solder joints.

Published: 2024-10-11

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