Vol. 33 No. 2 (2020): Journal of Surface Mount Technology
This issue includes three papers of significance to the electronics manufacturing industry. In the first paper, how conformal coating stresses the WLCSP is studied under conditions of thermal cycling. Next, we focus on enhancing the productivity of plating on PCBs using periodic pulse plating technique. The final paper discusses the effects of multi-axial loading on performance of WLCSP during thermal cycling.