Vol. 36 No. 1 (2023): Journal of Surface Mount Technology
This issue includes three papers of significance to the electronics manufacturing industry. The first paper investigates the influence of Pb-poisoning on Sn-whisker formation (and mitigation) on tin plated components, and provided a guidance to revise GEIA-STD-0005-2. The next paper closely studied the reliability of various BGA packages under static flexural loading at different temperatures up to 125°C along with Finite Element Modeling (FEM) to provide risk assessment for designers. The final paper delved into a novel approach for printing conformal interconnects with Aerosol Jet® direct-write technology that can offer package designers an alternate approach to wire bonding and other widely used interconnection techniques.