Vol. 36 No. 2 (2023): Journal of Surface Mount Technology
As we kick off the summer season, we are eager to share another issue of high quality electronics manufacturing research for you to read. The first article addresses Modeling the Effects of Thermal Pad Voiding on Quad Flatpack No-lead (QFN) Components. The second article provides a review of how the research has evolved related to Pb-Free Solders and Aerospace/Defense (A&D) High Performance Considerations over the decades. The third paper demonstrates a novel solder connect technology for Lower Temperature Soldering Using Supercooled Liquid Metal.
Published:
2023-07-03
