About the Journal
The Journal of SMT is a peer-reviewed, open access, technical publication of articles related to electronics manufacturing technologies, including microsystems, emerging technologies, and related business operations.
Current Issue
In this issue, we bring you three interesting technical articles. The first paper explores the intermediate barrier performance of electroless Co-W-B and Ni-P stacked deposits. We follow that with a look at a cleaning process simulation using glass test boards. The final paper compares electromigration in tin-bismuth planar and bottom terminated component solder joints.
Full Issue
About the Journal Committee
Committee Mission Statement
The mission of the SMTA Journal Committee is to select and review papers for publication in the Journal of SMT, ensuring a high standard of quality for each issue and ensuring article content best serves SMTA membership and the electronics industry as a whole.
Committee Members
Srinivas Chada, Ph.D., General Dynamics, Committee Chair
Kola Akinade, Ph.D., Cisco Systems (Retired)
Babak Arfaei, Ph.D., Binghamton University
Raiyo Aspandiar, Ph.D., Intel Corporation
Nilesh Badwe, Ph.D., IIT Kanpur
Tom Borkes, The Jefferson Project
Rich Brooks, Spartronics
Jean-Paul Clech, Ph.D., EPSI, Inc.
Richard Coyle, Ph.D., Nokia Bell Labs
Gary Freedman, Colab Engineering, LLC
Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory
Prasad Godavarti, Ph.D., Blue Origin (Retired)
David Hillman, Collins Aerospace (Retired)
Amol Kane, SLB
Pradeep Lall, Ph.D., M.B.A., Auburn University
Tae-Kyu Lee, Ph.D., Cisco Systems, Inc.
Luu Nguyen, Ph.D., Psi Quantum
Anthony Primavera, Ph.D., Micro Systems Engineering, Inc.
Viswanadham Puligandla, Ph.D., Nokia (Retired)
Paul Vianco, Ph.D., Sandia National Laboratories (Retired)
About SMTA
SMTA is an international network of professionals who build skills, share practical experience and develop solutions in Electronics Manufacturing (EM), including microsystems, emerging technologies, and related business operations.