Tin Whisker Formation on Small Outline Transistors Assembled Using Bismuth-Containing Lead-Free Solder Alloys After Long-Term Ambient Temperature, High Humidity Storage Part 2: Statistical Analysis. Journal of Surface Mount Technology, [S. l.], v. 33, n. 1, p. 7–19, 2020. DOI: 10.37665/smt.v33i1.14. Disponível em: https://journal.smta.org/index.php/smt/article/view/14. Acesso em: 27 dec. 2025.