A New Efficient Thermomechanical Reliability Model for Lead-Free Solder Joints. Journal of Surface Mount Technology, [S. l.], v. 38, n. 1, p. 14–25, 2025. DOI: 10.37665/3s3yym79. Disponível em: https://journal.smta.org/index.php/smt/article/view/68. Acesso em: 15 apr. 2026.