The Challenge of Lower Temperature Soldering for Large Ball-Grid Array (BGA) Board-Level Assembly – Phase 1. Processing. Journal of Surface Mount Technology, [S. l.], v. 39, n. 1, p. 2–14, 2026. DOI: 10.37665/jqvy6470. Disponível em: https://journal.smta.org/index.php/smt/article/view/67. Acesso em: 30 may. 2026.