Tin Whisker Formation on Small Outline Transistors Assembled Using Bismuth-Containing Lead-Free Solder Alloys After Long-Term Ambient Temperature, High Humidity Storage Part 3: In-Depth Characterization and Mechanisms. Journal of Surface Mount Technology, [S. l.], v. 34, n. 1, p. 11–23, 2021. DOI: 10.37665/smt.v34i1.23. Disponível em: https://journal.smta.org/index.php/smt/article/view/23. Acesso em: 23 oct. 2025.