The Influence of Element Lead (Pb) Content in Tin Plating on Tin Whisker Initiation/Growth. Journal of Surface Mount Technology, [S. l.], v. 36, n. 1, p. 2–11, 2023. DOI: 10.37665/smt.v36i1.28. Disponível em: https://journal.smta.org/index.php/smt/article/view/28. Acesso em: 23 oct. 2025.