Modeling the Effects of Thermal Pad Voiding on Quad Flatpack No-lead (QFN) Components. Journal of Surface Mount Technology, [S. l.], v. 36, n. 2, p. 2–7, 2023. DOI: 10.37665/smt.v36i2.37. Disponível em: https://journal.smta.org/index.php/smt/article/view/37. Acesso em: 1 jun. 2026.