Properties of Mixing SAC Solder Alloys with Bismuth-Containing Solder Alloys for a Low Reflow Temperature Process. Journal of Surface Mount Technology, [S. l.], v. 36, n. 3, p. 25–34, 2023. DOI: 10.37665/smt.v36i3.6. Disponível em: https://journal.smta.org/index.php/smt/article/view/6. Acesso em: 17 apr. 2026.