Cu Conductive Paste as Via Filling Materials for Various Substrates. Journal of Surface Mount Technology, [S. l.], v. 38, n. 1, p. 2–7, 2025. DOI: 10.37665/f3z77681. Disponível em: https://journal.smta.org/index.php/smt/article/view/65. Acesso em: 9 mar. 2026.