Tin Whisker Formation on Small Outline Transistors Assembled Using Bismuth-Containing Lead-Free Solder Alloys After Long-Term Ambient Temperature, High Humidity Storage Part 2: Statistical Analysis. Journal of SMT [Internet]. 2020 Jul. 14 [cited 2025 Dec. 27];33(1):7-19. Available from: https://journal.smta.org/index.php/smt/article/view/14