Tin Whisker Formation on Small Outline Transistors Assembled Using Bismuth-Containing Lead-Free Solder Alloys After Long-Term Ambient Temperature, High Humidity Storage Part 3: In-Depth Characterization and Mechanisms. Journal of SMT [Internet]. 2021 Apr. 5 [cited 2026 May 6];34(1):11-23. Available from: https://journal.smta.org/index.php/smt/article/view/23