Vol. 37 No. 1 (2025): Journal of Surface Mount Technology
This issue includes three interesting technical articles. The first paper explores copper conductive pastes as via filling materials for various substrates. That is followed with a look at the development of silicon interposers for 3D heterogeneous integration. The final paper discusses a new thermomechanical reliability model for lead-free solder joints.
Published:
2025-04-04
