Vol. 37 No. 1 (2025): Journal of Surface Mount Technology

Journal of SMT Cover, Volume 37, Issue 1, 2025

This issue includes three interesting technical articles. The first paper explores copper conductive pastes as via filling materials for various substrates. That is followed with a look at the development of silicon interposers for 3D heterogeneous integration. The final paper discusses a new thermomechanical reliability model for lead-free solder joints.

Published: 2025-04-04

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