Vol. 39 No. 2 (2026): Journal of Surface Mount Technology
In this second issue of 2026, we are pleased to bring you three papers on electronics assembly research. The first paper investigates innovative material reinforcement strategies for advanced packaging in the automotive sector. The next paper focuses on solder joint reliability of middle P% and high P% Ni/Au with low melting point solder. The final paper in this edition explores the progression of AI agents vs human experts as it relates to component placement material downtime.
Published:
2026-09-11
