Vol. 36 No. 3 (2023): Journal of Surface Mount Technology

Journal of SMT Cover, Volume 36, Issue 3, 2023

As we enter the fall season, we are eager to share another issue of high quality electronics manufacturing research for you to read. This issue features research on three rather distinct topics. The first article addresses a novel process evaluation technique for enhancing yields for advanced low-profile bottom terminated component packages. The second article examines solderability of additively manufactured copper surfaces. The third paper demonstrates properties of mixing SAC solder alloys with Bismuth-containing alloys for a low reflow temperature process.

Published: 2023-10-26

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