Vol. 39 No. 1 (2026): Journal of Surface Mount Technology
In this first quarter edition for 2026, we have three exciting papers for your reading pleasure. Low temperature soldering has been a hot topic for the past half decade, and the first paper investigates challenges facing reflow soldering SAC Plastic Ball Grid Array (PBGA) with solders containing Bi and rationalizes the solder joint formation based on melting and solidification behavior of the Bi- containing solders studied. The next paper focuses on the challenges of dispensing liquid Thermal Interface Materials (TIM) as Liquid Metal Paste (LMP). The final paper in this edition explores the thermo-mechanical and mechanical reliability of a novel lead-free alloy in extreme operating conditions.
Published:
2026-01-19
