Vol. 34 No. 2 (2021): Journal of Surface Mount Technology
This issue includes three papers of significance to the electronics manufacturing industry. The first paper covers Dissimilar Self-Alignment Characteristics of Smaller Passive Components. The second paper addresses Miniaturized Stacked Die QFN for Tire Pressure Monitoring System Applications. The third paper discusses High Density RDL Technologies for Panel Level Packaging of Embedded Dies.