Periodic Pulse Plating of Mid-Aspect Ratio Printed Circuit Boards for Enhanced Productivity

Authors

  • Carmichael Gugliotti MacDermid Alpha Electronics Solutions
  • Rich Bellemare
  • Andy Oh
  • Ron Blake

DOI:

https://doi.org/10.37665/smt.v33i2.7

Keywords:

Pulse Plating, Copper Plating, Mid-Aspect Ratio

Abstract

ABSTRACT

Pulse plating of copper has typically found use in the plating of very difficult, high aspect ratio printed circuit boards. Its ability to provide throwing power deep within through holes with aspect ratios as high as 30:1 is well established. This technology has long been thought of as a high technology, high cost, specialty process applicable only to high end products. This paper will discuss the advantages that pulse plating offers over conventional DC copper plating in high volume production applications for panels with aspect ratios of up to 12:1. These advantages are reduced plating time, increased throughput, and reduced plated copper thickness on the panel surface while meeting minimum in-hole copper thickness requirements.  

Journal of Surface Mount Technology, Volume 33, Issue 2

Downloads

Published

2020-10-02

Issue

Vol. 33 No. 2 (2020): Journal of Surface Mount Technology

Section

Articles

License

Authors retain copyright and grant the journal right of first publication with the work simultaneously licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License that allows others to share the work with an acknowledgment of the work's authorship and initial publication in this journal.

How to Cite

Periodic Pulse Plating of Mid-Aspect Ratio Printed Circuit Boards for Enhanced Productivity. (2020). Journal of Surface Mount Technology, 33(2), 14-21. https://doi.org/10.37665/smt.v33i2.7